High-frequency semiconductor technologies for radar, wireless communication, sensing, and signal processing applications.
RF & MicrowaveIntegrated Circuits
STARDL delivers a high-performance portfolio of RF, microwave, and millimeter-wave (mmWave) integrated circuits (ICs). Providing everything from fundamental gain blocks to complex signal-control devices, we empower next-generation wireless architectures, radar systems, and high-frequency sensing platforms worldwide.
Engineered for High-Density System Integration
The STARDL RF and microwave product portfolio is designed for exceptional high-frequency performance, reliable long-term operation, and space-saving integration. Covering frequencies from low GHz ranges up to the millimeter-wave bands, our comprehensive lineup supports seamless signal transmission, amplification, conversion, routing, attenuation, and precision timing control.
We focus on delivering highly compatible, die-level and packaged solutions that allow engineering teams to simplify RF front-end design, optimize thermal management, and overcome strict space constraints.
Product Categories
BARE DIE
Unpackaged wafer-level chips optimized for Hybrid Microwave Integrated Circuits (HMICs) and advanced micro-assembly. Eliminating package parasitics allows these components to achieve minimal signal loss, excellent thermal dissipation, and compact layout density.
- Ultra-Compact Low Noise Amplifiers (millimeter-scale footprints)
- High-Gain Driver & High-Efficiency Power Amplifier Dies
- Wideband Mixers, Multipliers, and Phase Shifters
- Digital Attenuators and Wafer-Level Limiter Chips
Extending frequency capabilities up to 50GHz, these bare dies provide the foundational space-saving and electrical performance required for radar front-ends and wideband transceivers.
PACKAGED ICS
Ready-to-use RF components designed to simplify board-level assembly. Offering packaging options from cost-effective plastic encapsulation to high-reliability hermetic ceramic sealing, these devices ensure stable electrical operation under diverse physical and environmental conditions.
- Low Noise Amplifiers (GaAs process)
- Broadband Driver & Power Amplifiers
- High-Isolation Digital RF Switches (up to SP6T)
- Attenuators, Limiters, and Equalizers
Operating across the DC to 40GHz frequency range, this portfolio balances high-performance RF metrics with standard Surface Mount Technology (SMT) compatibility.
GAN POWER DEVICES
High-power, high-efficiency RF front-end components built on Gallium Nitride (GaN) technology. Featuring pre-matched internal impedance networks, these power amplifiers maintain stable linearity and ruggedness under large-signal, Continuous Wave (CW), or pulsed operating modes.
- Broadband GaN Internally-Matched Power Amplifiers
- Continuous Wave (CW) Mode Power Amplifiers
- Pulsed Mode Power Amplifiers for Radar Applications
- High-Efficiency Power RF Front-End Modules
Providing output power up to 100W with exceptional thermal stability within the 0.5GHz to 8.0GHz spectrum, this line is engineered specifically for infrastructure base stations and defense systems.
Essential components for out-of-band rejection and signal routing within complex RF chains. Utilizing 3D Silicon Integration (TSV/TGV) and micromachining processes, these devices deliver high attenuation profiles without adding bulk to the system layout.
- TSV & TGV Precision Miniature Bandpass / Lowpass Filters
- High-Performance MEMS Filters
- High-Q Micro Chip Inductors (footprints down to 0.6×0.6mm)
- SAW and Microwave Ceramic Filters
Achieving sharp out-of-band attenuation within ultra-small wafer-level form factors, these passive elements isolate key frequencies and protect receiver links from spurious interference.
Application Areas
Radar Systems
RF Front-End Architectures
Wireless Communication Equipment
Signal Monitoring Systems
Microwave Transmission Systems
Satellite Communication Equipment
Satellite Communication Equipment
High-Frequency Test Platforms
Why Work With STARDL
Ultra-Compact Form Factors
Die-level and advanced packaging solutions are heavily optimized for high-density, space-constrained systems like phased-array T/R modules.
Comprehensive Frequency Coverage
Products span RF, microwave, and deep into millimeter-wave bands to meet next-generation high-bandwidth demands.
Industrial-Grade Electrical Reliability
Ruggedized chip architectures ensure stable linearity, low noise, and high performance across complex electromagnetic and wide temperature environments.
Forward-Looking R&D
Continuous investment in ultra-wideband, high-power, and monolithic microwave integrated circuit (MMIC) technology innovations.
End-to-End Signal Chain Solutions
From amplification and routing to conversion and control, we offer a complete ecosystem to build your entire RF front-end.
Technical Support & Product Selection
Our team can assist with product selection, frequency matching, RF architecture recommendations, and application-specific integration requirements. Datasheets and technical information are available upon request.
Are you looking for advanced RF or microwave semiconductor products?
Get in touch to request datasheets, order evaluation samples, or discuss custom specifications with our technical sales team.
