SDL-Tx1024 Ka-Band Two-Dimensional Phased Array Transmit Antenna Panel

The SDL-Tx1024 is an ultra-lightweight 400g Ka-band phased array tx antenna panel integrating 1,024 radiating elements and advanced SmartFusion technology to deliver high-capacity uplink transmission for hybrid LEO and GEO satellite networks.

  • Size & Weight: 273×150×14.5mm, ≤400g Ultra-thin Sub-assembly
  • Core Tech: 1024-Element Matrix, SmartFusion Engine, External Converters
  • Tracking Sweep: 360° Azimuth, 0°–70° Electronic Elevation Scan
  • Ports & Power: J30J-21 Control, SMA-K RF, 12V, ≤170W / ≤320W Scalable Draw

Product Details

Product Overview

Hardware integrators engineering premium Ka-band mobile uplink terminals frequently face severe structural limits and intense heat buildup when deploying traditional heavy block upconverters and motorized dishes. The SDL-Tx1024 overcomes these deployment bottlenecks by packaging a high-density 1,024-element matrix into a solid-state flat panel that is only 14.5mm thick. Delivering an exceptionally high EIRP output equal to or greater than 44dBW or 49dBW depending on system configuration, it supports arbitrary polarization tracking with cross-polarization isolation exceeding 25dB at center alignment. Operating continuously without mechanical wear across extreme outdoor temperatures from -40°C to +70°C, this sub-assembly provides a highly dependable LEO GEO satellite transmission component built to sustain high-bandwidth data pipelines where physical space is extremely restricted.

Key Specifications

Receiving Operating Frequency 27.5GHz-31.0GHz
Scan Range Elevation scan: 0°~70°; Azimuth: 0°~360°
Number of Elements 1024
Antenna EIRP ≥44dBW / ≥49dBW
Polarization Mode Arbitrary Polarization
Linear Cross Polarization Isolation ≥25dB@0°
Power & Control Interface J30J-21
RF Interface SMA-K
Overall Dimension 273mm×150mm×14.5mm
Input Power Supply DC12V (11V~13V)
Weight ≤400g
Power Consumption ≤170W / ≤320W
Operating Temperature -40℃~+70℃

FQA

Why does the SDL-Tx1024 omit internal up/down conversion circuitry from its hardware layer?
By keeping the frequency up-conversion stages external to the primary antenna board, the SDL-Tx1024 minimizes localized heat stacking on the active radiating face during high-power transmit cycles across the demanding 27.5GHz–31.0GHz Ka-band block. This architectural approach slashes the module thickness to just 14.5mm and cuts total weight to ≤400g, allowing system engineers full freedom to route RF signals via standard SMA-K interfaces.
How does SmartFusion technology manage the power draw and thermal profile of this transmit panel?
Transmitting high-throughput Ka-band data streams from 1,024 active elements typically generates intense heat. The built-in SmartFusion architecture acts as an intelligent power-scaling engine, dynamically optimization-tuning the RF drive currents fed to individual elements based on real-time uplink demands. This keeps power consumption bounded within highly efficient ≤170W or ≤320W operational thresholds, preventing thermal spikes in enclosed terminal builds.
What type of connection interface and power infrastructure does this Ka-band transmitter require?
This ka-band satellite transmitter module uses a secure, aviation-grade J30J-21 multi-pin control port to handle high-speed electronic beam steering commands and main power inputs. The hardware runs on a low-voltage DC 12V supply line (with a functional operating tolerance range of 11V to 13V), ensuring simple integration into mobile vehicle roof mounts, portable briefcase kits, or compact drone payloads.
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